Prompt
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Cu / Al dynamic cladding |
Cu / Al Rolling |
|
Bonding rate |
metallurgical bonding |
air and moisture directly enter Cu / Al interface |
Electro corrosion |
No electric corrosion |
The potential difference causes electric corrosion and accelerates aluminum oxidation |
Resistance |
Low resistance in interface |
Hign resistance in interface |
Stability |
Good stability and high bonding strength |
The thermal expansion coefficient difference between copper and aluminum is large |
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